Based on the theme, Smarter Systems Integration, the 3rd Annual European 3D TSV Summit will address the most relevant and controversial issues related to 2.5 and 3D manufacturing. The event features over 20 invited speakers from design houses, IDMs, OSATs, as well as from equipment and materials suppliers who will share their views during plenary presentations and panel discussions. Executives and experts from leading global companies will address the latest business and technological issues pressing the industry — including cost of ownership, business models, supply chain, manufacturability and other technological aspects.
To help set the stage, the steering committee engaged a number of influential industry speakers to share their perspectives. Bryan Black, Senior Fellow, AMD will present new information in his talk, Die Stacking is Happening. From the world of the system-integrator, Timo Henttonen, Senior Manager, Microsoft, will offer his thoughts on The Future of 3D TSVs. And from the assembly and packaging sector, Bill Chen, Fellow and Technical Advisor, ASE will discuss Integrating 3D into the Packaging DNA.
As advanced interposer and 3D IC technologies go into production, the concerns have shifted from technology issues to business-related ones. As such, the steering committee has organized a pre-conference symposium market briefing on Monday, January 19 at 4pm, featuring presentations by four market research organizations that specialize in semiconductor market analysis. Presentations will include:
- The Future of Packaging and Test: Convergence or Coexistence? Barnett Silver, SVP & Principal, ATREG
- From Development to Manufacturing: An Overview of Industry’s 3D Packaging Activities, Rozalia Beica, CTO, Yole Développement
- Gap Analysis: Focus Areas for 3D IC Advancements, Jan Vardaman, President, TeachSearch International
- Cost Modeling for 2.5/3D Technologies and Supply Chain Impacts, Scott Jones, Director, Alix Partners
Additionally, a panel discussion moderated by Jean-Christophe Eloy, CEO Yole Développement, will focus on TSV to Products – What Business for 3D Smart Systems?
- Ron Huemoeller, Senior VP Advanced Product / Platform Development, AMKOR
- Martin Schrems, VP of R&D, ams AG
- Bryan Black, Senior Fellow, AMD
- Mustafa Badaroglu, Senior Program Manager, Qualcomm
The remainder of the program will include presentations from amsAG, Qualcomm, STMicroelectronics, IBM, HP Labs, AMKOR, imec, CEA-LETI, Fraunhofer-IZM, Broadpak, SPTS, EV Group, BESI, Corning, Asahi, Rudolph Technologies, KLA Tencor, Oerlikon Systems, and Fraunhofer IKTS.
Companies will also showcase their products and services in the exhibition zone. In addition to the exhibit and conference, attendees will have the opportunity to schedule on-site business meetings through the event’s online business meeting platform and to visit the CEA-Leti 300mm TSV-capable clean room. Networking opportunities abound at this year’s Summit, beginning with the cocktail reception in the Exhibition Hall on Monday evening after the pre-conference symposium. Coffee breaks and lunch also take place in the exhibition hall. This year’s Gala cocktail reception and seated dinner promises to be a stellar event. It will be held offsite at nearby Château de Sassenage, transportation to and from Minatec will be provided.