The 17th Electronics Packaging Technology Conference (EPTC 2015) is an International event organized by the IEEE Reliability/CPMT/ED Singapore Chapter and sponsored by IEEE CPMT Society. EPTC 2015 will be held at Marina Mandarin Hotel, located in vicinity of Suntec city, Singapore from 2nd,3rd and 4th December 2015.
EPTC 2015 will be held at Marina Mandarin Hotel, located in vicinity of Suntec city, Singapore from 2nd,3rd and 4th December 2015.
EPTC 2015 will feature technical sessions, short courses/forums, an exhibition, social and networking activities. It aims to provide a good coverage of technological developments in all areas of electronic packaging from design to manufacturing and operation. It is a major forum for the exchange of knowledge and provides opportunities to network and meet leading experts in the field.
Abstracts for presentation at the 17th Electronics Packaging Technology Conference are now being accepted on any of the Conference topics below:
- Advanced Packaging
- TSV/Wafer Level Packaging
- Interconnection Technologies
- Emerging Technologies
- Materials & Processes
- Electrical Modeling & Simulations
- Mechanical Modeling & Simulations
- Thermal Characterization & Cooling Solutions
- Quality & Reliability
- Wafer/Package level & TSV Testing and Characterization
The full Call for Papers details are available here. Submit abstracts here.
Abstracts Due May 30, 2015