The 2014 Electronic Components and Technology Conference (ECTC 2014) is an international event that brings together leaders in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the Components, Packaging and Manufacturing Technology (CPMT) Society of the IEEE. ECTC 2014 features about 40 technical sessions ( over 300 papers total including oral presentations, interactive presentations, and student posters) covering all aspects of electronic packaging and interconnect technology;16 professional development courses, a panel discussion, a plenary session, a CPMT Seminar, and a technology corner for exhibitors. ECTC 2014 will be held at the Walt Disney World Swan and Dolphin Resort, Lake Buena Vista, Florida, USA.
Online Registration is now open.