You are invited to attend a workshop on the new DARPA Microsystems Technology Office (MTO) initiative “2.5D/3D Foundry.” The Workshop will be held at Embassy Suites San Francisco Airport Waterfront in Burlingame, CA on December 6, 2018.
In the last few years, we have seen a proliferation of successful commercial 2.5D/3D silicon products, including multi-die FPGAs, GPUs, and machine learning ASICs. Unfortunately, the integration capabilities available to large system and silicon merchant vendors have not been accessible to lower volume customers like the US Department of Defense.
The DARPA CHIPS program kicked off in 2017 to develop interface standards, silicon design reuse methodologies, and chiplet assembly technologies to demonstrate modular integrated circuit (IC) designs that leverage the best of DoD and commercial integrated circuit design technology. The CHIPS program has made significant progress towards the establishment of a chiplet
based ecosystem, but does not yet have a clear path to low-volume manufacturing.
The 2.5D/3D foundry workshop will bring together experts from industry, government, and academia to discuss the potential for development of a US-based interposer and fine pitch assembly factory/foundry model for 2.5D and 3D integrated silicon systems like those envisioned by the Common Heterogeneous Integration and IP Reuse Strategies (CHIPS) program. The goal is to provide
access to leading-edge integration technologies that are now accessible only to major commercial customers.
If you are interested in participating in the DARPA/MTO 2.5D/3D Foundry Workshop, please register here. You will also find a draft workshop agenda there shortly, as well as information about lodging. The registration deadline is November 30, 2018. Registration is limited by the venue capacity, and early registration is strongly recommended. We look forward to your attendance and input.
All attendees must submit a completed and signed U.S. Citizenship, Permanent Resident Verification, or Foreign National form to Tamika Celestin no later than 12:00 PM Eastern on November 30, 2018. All forms are available upon completed registration via the meeting registration website.
