Entegris, in collaboration with imec, Fraunhofer, Fujifilm, Mechatronic and SEMI, cordially invites you to attend a seminar on the challenges of 3D IC technology. Hear from multiple points of view, and learn about current and future developments.
Take this opportunity to:
- Meet the experts
- Share your experience
- Expand your network
10.00 Opening
- Luc van Autryve, 3D IC Worldwide Program Manager – Entegris
10.15 3D IC Standards: Cornerstone of Successful High Volume Manufacturing Products
- Yann Guillou, Business Development Manager – SEMI Europe, Grenoble
10.45 3D Integration Roadmap and Challenges
- Gerard Beyer, PhD , Program Manager 3D – imec
11.30 Materials Research and Nanoanalysis – Keys for Reliable 3D Products
- Martin Gall, Ph.D. – Department Head, Materials and Reliability for Micro- and Nanoelectronics Fraunhofer Institute for Ceramic Technologies and Systems IKTS-MD
12.00 Packing – Unpacking and Sorting
- Mr. Werner Kornmayer, Sales Manager – Mechatronic
13.30 3D and Thin Wafer Handling Solutions
- Paul Rosenfeld, Director Business Development – Entegris
14.00 Novel Low Temperature Cure Dielectrics for Improved Package Reliability Typical for Wafer Level Packaging and 3D/IC Stacked Packages
- Stefan Vanclooster, Business Development Manager – Fujifilm Electronics Materials Europe
14.30 IntelliGen® HV Filtration and Dispense System Dedicated to High Viscosity Chemicals
- Laurent Stock, Global Product Support – Entegris
14.50 Panel Discussion on Universal Thin Wafer Handling in 3
