05/14/2014 -10:00 am - 4:00 pm

Location: The Lodge Heverlee

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entegrisEntegris, in collaboration with imec, Fraunhofer, Fujifilm, Mechatronic and SEMI, cordially invites you to attend a seminar on the challenges of 3D IC technology. Hear from multiple points of view, and learn about current and future developments.

Take this opportunity to:

  • Meet the experts
  • Share your experience
  • Expand your network

Registration information

10.00 Opening

  • Luc van Autryve, 3D IC Worldwide Program Manager – Entegris

10.15 3D IC Standards: Cornerstone of Successful High Volume Manufacturing Products

  • Yann Guillou, Business Development Manager – SEMI Europe, Grenoble

10.45 3D Integration Roadmap and Challenges

  • Gerard Beyer, PhD , Program Manager 3D – imec

11.30 Materials Research and Nanoanalysis – Keys for Reliable 3D Products

  • Martin Gall, Ph.D. – Department Head, Materials and Reliability for Micro- and Nanoelectronics Fraunhofer Institute for Ceramic Technologies and Systems IKTS-MD

12.00 Packing – Unpacking and Sorting

  • Mr. Werner Kornmayer, Sales Manager – Mechatronic

13.30 3D and Thin Wafer Handling Solutions

  • Paul Rosenfeld, Director Business Development – Entegris

14.00 Novel Low Temperature Cure Dielectrics for Improved Package Reliability Typical for Wafer Level Packaging and 3D/IC Stacked Packages

  • Stefan Vanclooster, Business Development Manager – Fujifilm Electronics Materials Europe

14.30 IntelliGen® HV Filtration and Dispense System Dedicated to High Viscosity Chemicals

  • Laurent Stock, Global Product Support – Entegris

14.50 Panel Discussion on Universal Thin Wafer Handling in 3