3D ASIP 2015

3D ASIP 2015

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Date/Time
Date(s) - 12/15/2015 - 12/17/2015
All Day

Location
Sofitel San Francisco Bay Hotel

Category(ies)


3D ASIP 2015  (3D Architectures for Semiconductor Integration and Packaging), now in its 12th year, is firmly established as the leading industry event in 3D integration and packaging. This conference presents a broad, yet thorough perspective on the techno-market opportunities and challenges offered by building devices and systems in the vertical dimension, and provides participants the unique opportunity to gain the latest technology and market insights on 3D integration and packaging efforts, and technology and industry trends impacting this dynamic arena.

Check out the full agenda and take advantage of early registration rates ending on November 24.

Plenary presentations will be delivered by Brandon Prior, Prismark, discussing the status of 2.5/3D and other high density technologies; Rozalia Beica, Yole Développement, comparing and contrasting the new 3D memory architectures; and Dyi-Chung Hu, Unimicron, reviewing the transformation of substrate technology in the era of IoT.

Conference General Chair Phil Garrou said, “This meeting has a lot of the key, high-density interconnect players involved. This year we have included sessions comparing the silicon 2.5D interposers to alternative technologies,” (see sessions 6 and 7 in the agenda).

The program also includes sessions on 3D stacked memory products; non-TSV high density solutions; the commercialization of Fiji graphics modules with HBM memory stacks; DARPA’s DAHI heterogeneous integration 3D platform; and stacked image sensor technology.

Tuesday Tutorials

Temporary Bonding / Debonding, moderated by Matt Lueck, RTI International. Presenters include:

  • Frank Fournel, CEA-Leti
  • Molly Hladik, Brewer Science
  •  Melvin Zussman, HD MicroSystems
  • David Fleming, Dow Chemical
  • Shoji Otaka, TOK
  • Stefan Lutter, SUSS

Design of ICs Using Interposers or Wafer-level Packaging, moderated by Herb Reiter, eda2asic, consultant. Presenters include:

  • Bill Isaacson, eSilicon
  •  Bill Martin, E-System Design
  • Norman Chang, ANSYS
  •  Brandon Wang, Cadence Design Systems
  •  Bill Acito, Product Engineer, Cadence Design Systems
  • Humair Mandavia, Zuken
  • John Ferguson and John Park, Mentor Graphics

Check out the growing list of sponsors and exhibitors. Opportunities are still available, but exhibit space is limited. Don’t be left out! Secure your spot today.