The 11th Annual Device Packaging Conference (DPC 2015) will be held in Fountain Hills, Arizona, on March 16-19, 2015. This international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS) is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.
This year IMAPS has decided to mix it up a bit, eliminating panel discussions, adding in evening technical sessions, and holding the Global Business Council on Wednesday.
Featuring Topical Workshop Tracks on:
- Advanced 3D Packaging
- Flip Chip and Wafer Level Packaging
- Microsystems & Devices (includes MEMS & Sensors)
- Photonics Packaging & Other Emerging Technologies
This year’s keynotes focus on die stacking, high end applications for interposer integration and 3D ICs, the Internet of Things, and mobile devices:
- Bryan Black, AMD, will present Die Stacking is Finally Happening
- Rozalia Beica, Yole Développement, will present on TSV applications in the graphics market and high-end computing with Current and Future Technology Developments for high-end applications
- Riko Radojcic, QUALCOMM, will focus on mobile products in his talk, 2.5D and 3D Integration: Where we Have Been, Where we are Now, Where We Need to Go
- Jan Vardaman, TechSearch, will also focus on the mobile market with her talk: Package Trend Changes and Challenges for Mobile Device; Is Thin Still In?
Global Business Council
The GBC’s topic this year is The Internet of Things. The speaker line-up includes:
- Bill McLean, IC Insights, IC Market Outlook in and Unstable Economy
- Stephen Whalley, MIG, Maximizing the Internet of Everything by Mobilizing the MEMS/sensors and Adjacent Ecosystems
- Mike Stanley, Freescale, Evolving Challenges for Sensor/MEMS Packaging
- Jan Vardaman, TechSearch International Inc. The Wearable Market and Packaging Requirements
- Rozalia Beica,Yole Développement, Market Trends and Evolution of IoT
- Jim Walker, Gartner, The Internet of Things (IoT) Applications: Examples of Real World Value Propositions
- Brandon Prior, Prismark Partners, Sensor Packages and Integration Trends to Accommodate IoT and Wearable Applications.
Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging. This venue features an ideal atmosphere to showcase your products and services to key decision making professionals in the industry. The exhibits have sold out every year since 2006 AND HAVE SOLD OUT AGAIN FOR 2015! We have more than 10 exhibitors on a wait-list at this time. For more information To reserve booth space, please contact Brian Schieman by email at or by phone at 412-368-1621.
For more information and to register, visit the IMAPS DPC Registration Info page.