The Global Interposer Technology (GIT) 2012 Workshop is intended to stimulate and disseminate the development of a wide variety of interposers such as silicon, glass and others. GIT 2012 brings together academic and industry researchers as well as technology developers, users and manufacturers from around the globe. Such a technology is seen as, not only for packaging of ICs and 3D ICs, but also as a future ultra-miniaturized platform for entire smart mobile and high performance systems.
GIT 2012 will focus on Interposer Technology with an expanded 3-day agenda including:
- Plenary talks from Industry and Academic experts
- Technical Sessions
- Interactive Poster Session
- Networking Reception
On Sunday, take part in the 2013 GIT Golf Classic. Georgia Tech’s Rao Tummala will open the event on Monday. An impressive line-up of invited speakers will cover everything from mobile technology trends driving the interposer market, to supply chain issues, to alternative material considerations for interposers. Companies represented include IBM, Intel, Qualcomm, GlobalFoundries, Amkor, ASE, Unimciron, CEA-Leti, TE Connectivity, Yole Developpment, Corning, Asahi Glass, SCHOTT Glass.
Session topics cover: organic Interposers; glass interposers; the manufacturing infrastructure; RF, MEMS, bio, analog, sensors and passives; and electrical, mechanical and thermal design.
Visit the GIT 2013 Website for more information and to register.