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SUSS MicroTec and BRIDG Join Forces to Establish a Production-Level Applications Center in North America

SUSS MicroTec and BRIDG Join Forces to Establish a Production-Level Applications Center in North America

admin December 3, 2019 Press Releases 0

SUSS MicroTec, leading supplier of equipment and process solutions for the semiconductor industry, announced today a far-reaching collaboration agreement with BRIDG, a not-for-profit, public-private partnership focused on production process technologies, advanced system integration, and 200mm microelectronics fabrication advancing next-generation nanoscale technology. This partnership puts an unpr... »

Lam Research Offers New Capabilities in its Edge Yield Product Portfolio

Lam Research Offers New Capabilities in its Edge Yield Product Portfolio

admin December 3, 2019 Press Releases 0

Lam Research Corp. (Nasdaq: LRCX) is offering new capabilities in its semiconductor manufacturing systems portfolio to further improve device yield at the edge of the wafer, which is essential to delivering greater productivity for customers. During the semiconductor production process, device manufacturers want to build integrated circuits on the entire surface of the wafer. On the edge of the wa... »

MRSI receives Laser Focus World Innovators Award for HVM Die Bonder

MRSI receives Laser Focus World Innovators Award for HVM Die Bonder

MRSI Systems November 26, 2019 Press Releases 0

MRSI Systems (Mycronic Group) a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has been recognized as a 2019 Silver Honoree for the Laser Focus World Innovators Award in the Manufacturing Equipment for Photonic Components category. The MRSI-HVM was recognized for a very good innovation that resulted in marked improvement over previ... »

Chiplets: Key Enablers for the Next 10-20 Years
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Chiplets: Key Enablers for the Next 10-20 Years

TechSearch International, Inc. November 26, 2019 Press Releases 0

Continued monolithic integration is expensive and can suffer from the defect density yield loss associated with large die. As a result, an increasing number of companies are turning to new architectures using chiplets to achieve the economic advantages lost with expensive monolithic scaling. TechSearch International’s new Advanced Packaging Update (APU) details many advantages of chiplets and pr... »

Siemens and Qualcomm Set Up First Private Standalone 5G Network in Industrial Environment

Siemens and Qualcomm Set Up First Private Standalone 5G Network in Industrial Environment

admin November 26, 2019 Postings, Press Releases 0

· Sustainable technological cooperation for the future of industrial wireless communication · Joint Proof of Concept in a real industrial environment using the 3.7-3.8 GHz band · Researching the capabilities of 5G standalone networks for industrial applications Siemens and Qualcomm Technologies, Inc. have implemented the first private 5G standalone (SA) network in a real industrial environment ... »

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