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UnitySC Opens Global Software Development Center and Customer Demo Lab in the U.S.

UnitySC Opens Global Software Development Center and Customer Demo Lab in the U.S.

Austin, Texas – Oct. 23, 2017 – UnitySC today announced at the International Wafer Level Packaging Conference (IWLPC) in San Jose, Calif., the opening of Unity Semiconductor Inc., the company’s new global software development center and North America customer demonstration lab located in Austin, Texas. The new facility serves as the company’s main center for software development and will h... »

imec and Analog Devices Sign Strategic Research Partnership for Development of Next-Generation IoT Devices
ADI2 ADI

imec and Analog Devices Sign Strategic Research Partnership for Development of Next-Generation IoT Devices

LEUVEN, Belgium, and NORWOOD, MA —October 12, 2017—Imec, the world-leading research and innovation hub in nanoelectronics and digital technologies and Analog Devices, Inc. (ADI), the leading global high-performance analog technology company, today announced they have entered into a strategic research partnership to develop the next generation of Internet of Things (IoT) devices. With two initi... »

EV Group and SwissLitho to Develop Joint Nanoimprint Lithography Solution for 3D Optical Structures with Single-Nanometer Accuracy
Press Photo - SwissLitho_ EV Group

EV Group and SwissLitho to Develop Joint Nanoimprint Lithography Solution for 3D Optical Structures with Single-Nanometer Accuracy

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and SwissLitho AG, a manufacturer of novel nanolithography tools, today announced a joint solution to enable the production of 3D structures down to the single-nanometer scale. Initially demonstrated within the “Single Nanometer Manufacturing for Beyond CMOS Devic... »

CEA-Leti Orders KOBUS Solution To Pursue Long-Term Partnership for Advanced CVD

CEA-Leti Orders KOBUS Solution To Pursue Long-Term Partnership for Advanced CVD

Montbonnot, France, 20th of September 2017  ̶  KOBUS, a leading equipment supplier in advanced deposition solutions, and Leti, a technology research institute of CEA Tech, are pursuing their long-term partnership through the acquisition by Leti of the latest generation of F.A.S.T.® (Fast Atomic Sequential Technology) 200mm solution from KOBUS. It will be used to increase Leti’s process capab... »

EV Group Receives Multiple Lithography and Metrology System Orders for Wafer-Level Optics Manufacturing
EV Group - Wafer-Level Optics Manufacturing

EV Group Receives Multiple Lithography and Metrology System Orders for Wafer-Level Optics Manufacturing

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has received multiple orders for its comprehensive portfolio of manufacturing equipment and services designed to address the burgeoning demand for wafer-level optics (WLO) and 3D sensing. The market-leading portfolio comprises the EVG®770 automat... »

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