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TechSearch International Analyzes High-Performance Package Trends
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TechSearch International Analyzes High-Performance Package Trends

A variety of alternatives is challenging silicon’s role in advanced packaging interposers for high-performance package applications. The first applications using silicon interposers with through silicon vias (TSVs) were field programmable gate arrays (FPGAs), followed by graphic processor units (GPUs). Though unit volumes have been small, the vast knowledge gained from these early pioneers is be... »

Equipment &  Materials for Fan-out: What is the Impact of On Manufacturing Markets?
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Equipment & Materials for Fan-out: What is the Impact of On Manufacturing Markets?

2016 was a turning point for fan-out (FO) packaging. With Apple’s entrance and its subsequent decision to package its A10 APE in TSMC’s fan-out solution, the market changed. Thus advanced packaging leaders decided large investments for the development of fan-out platforms, impacting the related equipment and materials market. “Indeed, both equipment and materials markets for fan-out wafer le... »

Advanced Packaging Industry: What We Can Expect in 2017…
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Advanced Packaging Industry: What We Can Expect in 2017…

2016 was the year of strong consolidations in the semiconductor industry. Yole Développement (Yole) highlights many mergers and acquisitions with several billions of dollars transactions.“And 2017 seems to be following the same path”, wrote Jérôme Azemar, Technology & Market Analyst, Advanced Packaging at Yole in an article posted on i-micronews.com. Year after year, the advanced packag... »

MRSI Systems Delivered 3-Micron Die Bonder to AIM Photonics Academy’s Education and Practice Factory at MIT

MRSI Systems Delivered 3-Micron Die Bonder to AIM Photonics Academy’s Education and Practice Factory at MIT

North Billerica, MA, USA, March 20, 2017 — MRSI Systems, a leading provider of fully automated, high-speed, high-precision die bonding and epoxy dispensing systems, today announces the installation of its flagship MRSI-M3 Die Bonder in AIM Photonics Academy’s Education and Practice Factory at the Massachusetts Institute of Technology (MIT) in Cambridge, MA, USA. This is the beginning of a grea... »

UnitySC Pushes The Boundaries of Measurement with New Nanotopography Metrology Platform
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UnitySC Pushes The Boundaries of Measurement with New Nanotopography Metrology Platform

Grenoble, France, March 14, 2017 – UnitySC, a wholly owned subsidiary of FOGALE Nanotech Group and a leader in inspection and metrology solutions for advanced semiconductor packaging, today introduced its new NST Series at SEMICON China in Shanghai. The NST Series is the world’s first non-contact metrology solution for accurately measuring the nanoscale surface topography of semiconductor wafe... »

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