News

EV Group Optimizes Resist and Lithographic Processing for Plasma Dicing for Advanced Semiconductor Packaging Applications
EVG IQ Aligner NT Automated Mask Alignment System EVG150 Automated Resist Processing System

EV Group Optimizes Resist and Lithographic Processing for Plasma Dicing for Advanced Semiconductor Packaging Applications

EV Group June 21, 2017 Postings 0

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it is demonstrating optimized pre-processing solutions for the implementation of plasma dicing for advanced semiconductor packaging applications. EVG’s latest products and process development services support this emerging semiconductor back-end fa... »

, , , , , ,
Artificial Intelligence: A New Era of the Advanced Packaging Industry
3DBUSINESSUPDATE_High-perf_Computing_DeepLearning_ValueChain_YOLE_June2017_433x280 3DBUSINESSUPDATE_3DTSV_25D_MarketDrivers_YOLE_June2017_433x280

Artificial Intelligence: A New Era of the Advanced Packaging Industry

YOLE DEVELOPPEMENT June 8, 2017 Postings 0

Artificial Intelligence (AI) is driving the development of 3D TSV and heterogeneous integration technologies. With its new 3D TSV & 2.5D business update report, Yole Développement (Yole), part of Yole Group of Companies investigates the advanced packaging industry and takes a closer look at the AI impact on this market. “3D integration is clearly offering today unequaled performances suitin... »

, , , , ,
New Design Flow and OSAT Alliance Program Jump-Start High-density Advanced Packaging
Unique HDAP Flow Enables Design Capture and Rapid Prototyping Disrupting Design Methods and Tools Mentor Introduces New Design Flow for HDAP Mentor: Proven differentiated capability for HDAP Mentor Delivers....

New Design Flow and OSAT Alliance Program Jump-Start High-density Advanced Packaging

Herb Reiter June 7, 2017 Press Releases 0

Editor’s note: For several years now, Mentor Graphics has evangelized about the critical need for assembly design kits to enable commercialization of high-density advanced packaging technologies, such as fine line and space fan-out, 2.5D and 3D IC packages. With this week’s introduction of a unique, end-to-end, high-density advanced packaging (HDAP) design flow, combined with the launch of an... »

, , , , , , , , , , ,
EV Group Expands Production Capacity at Corporate Headquarters in Austria
DCIM100MEDIADJI_0029.JPG Photo 2

EV Group Expands Production Capacity at Corporate Headquarters in Austria

EV Group June 1, 2017 Press Releases 0

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is expanding production capacity at its corporate headquarters in St. Florian am Inn, Austria. Representing a 20 million Euro investment, the expansion will include the construction of a new building that provides additional production and te... »

, , , , , , , , ,
Rudolph JetStep S Lithography System Advances Panel-based Advanced Packaging

Rudolph JetStep S Lithography System Advances Panel-based Advanced Packaging

Rudolph Technologies May 30, 2017 Press Releases 0

Wilmington, Mass. (May 23, 2017)—Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has received an order for its JetStep S Lithography System for fan-out panel-based advanced packaging processes. The system, which will ship in June 2017 to an outsourced assembly and test (OSAT) facility based in Asia, will be used to produce system-in-package (SiP) products that combine sensor, pro... »

, , , , , ,
Page 1 of 68123›»