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TechSearch International Analyzes Trends in Packages for AI Applications

TechSearch International Analyzes Trends in Packages for AI Applications

Artificial Intelligence (AI) combines both hardware and software.  TechSearch International’s latest analysis explains the packages behind AI applications. AI accelerators found in datacenters require high-density packages to support logic plus high bandwidth memory (HBM). Many silicon interposer designs are in mass production and Intel’s EMIB is also used.  Package-on-package (PoP) is use... »

Xperi and UMC Partner to Produce Direct and Hybrid Bonding 3D Semiconductor Technologies

Xperi and UMC Partner to Produce Direct and Hybrid Bonding 3D Semiconductor Technologies

SAN JOSE, Calif. (August 2, 2018) – Xperi Corporation (Nasdaq: XPER) (“Xperi”) is pleased to announce a partnership with leading global semiconductor foundry, UMC. This strategic partnership will enable the companies to support the growing demand for Invensas’ direct and hybrid bonding (ZiBond® and  DBI®) 3D semiconductor technologies. Together, Xperi and UMC will further optimize ... »

Leading Memory Chip Manufacturer Purchases Multiple Veeco AP300 Lithography Systems
AP300_logo rendering

Leading Memory Chip Manufacturer Purchases Multiple Veeco AP300 Lithography Systems

PLAINVIEW, New York, July 9, 2018 – Veeco Instruments Inc. (Nasdaq: VECO) today announced that one of the world’s leading memory chip manufacturers has ordered multiple AP300™ lithography systems to support the fast-growing demand for DRAM with copper (Cu) pillars. The company selected the Veeco tools for their versatility in addressing advanced packaging applications, proven reliability in ... »

New Defect Inspection Systems Address Process and Tool Monitoring Challenges

New Defect Inspection Systems Address Process and Tool Monitoring Challenges

MILPITAS, Calif., July 10, 2018—Today KLA-Tencor Corporation (NASDAQ: KLAC) announced two new defect inspection products, addressing two key challenges in tool and process monitoring during silicon wafer and chip manufacturing at the leading-edge logic and memory nodes. The VoyagerTM 1015 system offers a new capability to inspect patterned wafers, including inspection in the lithography cell imm... »

 Latest Abatement System Installation Marks a Milestone of Success for Edwards

 Latest Abatement System Installation Marks a Milestone of Success for Edwards

SAN FRANCISCO – SEMICON West (11 July 2018) – Edwards Vacuum, a leading manufacturer of vacuum and abatement solutions, announces a milestone of 10,000 Edwards inward fired combustion abatement systems installed worldwide. Edwards calculates that its abatement systems have prevented emissions equivalent to over 14 million tons of carbon dioxide in 2017. “The safety and efficiency of our ... »

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