News

And the winners of the MEMS, Imaging and Sensors Summits tech showcases are…
IMG_0312 IMG_0297 IMG_0313 IMG_0355

And the winners of the MEMS, Imaging and Sensors Summits tech showcases are…

The technology showcases at the European MEMS and Sensors and Imaging Sensors Summits give start-ups and established companies alike ten minutes to pitch their latest innovation to the crowd, after which attendees vote for the best. The competition is fierce, and the prize – a free booth the following year – is much sought after. Each summit has one winner, and they were announced during the g... »

Veeco Announces Changes to Executive Leadership Team
Veeco billmiller1 Sam Maheshwari

Veeco Announces Changes to Executive Leadership Team

PLAINVIEW, N.Y., September 4, 2018 —Veeco Instruments Inc. (NASDAQ: VECO) today announced that John Peeler, Chairman, and Chief Executive Officer, will transition to the role of Executive Chairman, effective October 1, 2018.  William J. Miller, currently President, will become Chief Executive Officer and will join the Company’s board of directors bringing the size of the board to eight.  Add... »

Brewer Science Unveils Dual-Layer Temporary Bonding System and Material for RDL-first Fan-Out Packaging

Brewer Science Unveils Dual-Layer Temporary Bonding System and Material for RDL-first Fan-Out Packaging

Rolla, Missouri – Sept. 4, 2018 – Brewer Science, Inc. today from SEMICON Taiwan introduced the latest additions to its industry-leading BrewerBOND® family of temporary bonding materials, as well as the first product in its new BrewerBUILD™ line of thin spin-on packaging materials. BrewerBUILD delivers an industry-first solution to address manufacturers’ evolving wafer-level packaging cha... »

Rudolph Technologies Launches Second-Generation Dragonfly Inspection and Metrology System for Advanced Packaging
dragonfly-g2-sm

Rudolph Technologies Launches Second-Generation Dragonfly Inspection and Metrology System for Advanced Packaging

Wilmington, Mass. (August 29, 2018)—Rudolph Technologies, Inc. (NYSE: RTEC) today announced its new Dragonfly™ G2 platform, which incorporates many of the benefits of the Firefly™ system onto the Dragonfly platform, including higher sensitivity and throughput and the proprietary Clearfind™ Technology. The new system increases the options for advanced packaging customers to meet their wafe... »

MRSI Systems Logo

MRSI’s MRSI-H3TO Die Bonding Product Family Supports the 5G Wireless Network Supply Chain

MRSI Systems (Mycronic Group) is launching the MRSI-H3TO, a new 3μm high speed die bonder which will be the first of its kind to address the multi-die and multi-process requirements, delivering industry-leading throughput, superior flexibility, and future-proven 3μm placement accuracy. The MRSI-H3TO is tailored for WDM/EML-TO or other multi-die multi-processing TO-can photonic devices to support... »

Page 1 of 80123»