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EV Group Celebrates 20 Years of Supporting Micro- and Nano-Technology Development in Japan
EV Group Japan 1 EV Group Japan 2 Picture1 Picture2 Picture3

EV Group Celebrates 20 Years of Supporting Micro- and Nano-Technology Development in Japan

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is celebrating the 20th anniversary of its wholly owned subsidiary in Japan, EV Group Japan KK. Established in August 1997 in Yokohama, EV Group Japan has since expanded its presence to include offices in Fukuoka and a state-of-the-art applic... »

TechSearch International Analysis Examines FO-WLP Developments and Sensor Packaging Trends

TechSearch International Analysis Examines FO-WLP Developments and Sensor Packaging Trends

Mobile devices, specifically smartphones, represent the single greatest volume driver for MEMS and other sensors today. Sensors found in these products include electronic compasses, motion sensors, barometers, microphones, and fingerprint sensors. Package types include land grid arrays (LGAs), lead frame packages such as QFNs, and wafer level packages (WLPs.). Apple is expected to account for 28 p... »

EMD Performance Materials Announces Comprehensive Materials Solutions for Chip Miniaturization and Smart Packaging
AZ Shisuoka EMD Performance Materials provides material solutions for the semiconductor industry

EMD Performance Materials Announces Comprehensive Materials Solutions for Chip Miniaturization and Smart Packaging

  Philadelphia PA, USA, July 10, 2017 – EMD Performance Materials, a leading science, and technology company, today announced its portfolio of materials solutions for advanced semiconductor manufacturing. Megatrends represented by big data, automotive electronics, IoT, and an increased interest in green assembly, is expanding the need for advanced semiconductor processing and novel materi... »

NXP and Nepes Create Value with their First FO PoP SiP for IoT

NXP and Nepes Create Value with their First FO PoP SiP for IoT

Advanced packaging is a key enabling technology that not only serves as packaging support but also offers more value and cost reduction to the final products. The advanced packaging industry with its 7% CAGR between 2016 and 2022 (in revenues)¹ is undoubtedly a dynamic sector where innovations play a key role. NXP’s SCM-i.MX6Q fan-out package-on-package system-in-package (FO PoP SiP) with boot ... »

Three Patents Granted to Smoltek

Three Patents Granted to Smoltek

Smoltek, a leading Swedish nanotech company in the semiconductor industry, has expanded its patent portfolio in Asia the last month. New patents in Japan and South Korea are important milestones to increase the company’s core patent portfolio footprint on growth methods for nanostructures. “With three new essential Asian patents granted within a month – in South Korea and Japan – w... »

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