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Kamel Ait-Mahiout Appointed as CEO of UnitySC
UnitySC_CEO_Kamel Ait-Mahiout

Kamel Ait-Mahiout Appointed as CEO of UnitySC

Grenoble, France – April 17, 2018 – UnitySC, a leader in advanced inspection and metrology solutions for the semiconductor and related industries, today announced that its board of directors has appointed Kamel Ait-Mahiout as chief executive officer. He has also been elected to serve on UnitySC’s board. Following the company’s recent announcement of the acquisition of HSEB Dresden, Gmb... »

UnitySC Acquires HSEB Dresden GmbH to Become a Global Leader in Semiconductor Process Control

UnitySC Acquires HSEB Dresden GmbH to Become a Global Leader in Semiconductor Process Control

Grenoble, France – March 20, 2018 – UnitySC, a leader in advanced inspection and metrology solutions, today announced it acquired 100% of the shares of HSEB Dresden, GmbH (HSEB), a leading supplier in optical inspection, review, and metrology for high-value semiconductor applications. Following the acquisition, the new entity’s extended line of leading-edge semiconductor process control solu... »

Apple selected substrate-like PCBs for its latest iPhones. Who’s next?
ILLUS_ADV_SUBSTRATES_Roadmap_Scalingfunctional_YOLE_March2018 (433x280) ILLUS_ADV_SUBSTRATES_PCBrevenues_SmartphonesApplication_YOLE_March2018 (433x280)

Apple selected substrate-like PCBs for its latest iPhones. Who’s next?

The semiconductor industry’s trends are affecting the semiconductor package and package-to-board interconnect level. Performance-driven applications like PCs and smartphones are giving way to functional applications that are plotting the semiconductor industry’s future course. Internet of Things (IoT), the automotive market, 5G connectivity, augmented and virtual reality (AR/VR), and artificia... »

EV Group and IBM Sign License Agreement on Laser Debonding Technology
EVG 850 DB Automated Debonding System with integrated film frame mounter

EV Group and IBM Sign License Agreement on Laser Debonding Technology

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and IBM (NYSE: IBM) today announced that the companies agreed to sign a license agreement on laser debonding technology. EVG plans to integrate IBM’s patented Hybrid Laser Release process into EVG’s advanced, field-proven temporary bonding and debonding equipmen... »

MRSI Systems’ New MRSI-HVM3 Die Bonder System Has Entered Volume Production

MRSI Systems’ New MRSI-HVM3 Die Bonder System Has Entered Volume Production

North Billerica, MA, March 6, 2018 – MRSI Systems, a leading provider of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems is pleased to announce that our new MRSI-HVM3 die bonder system has entered a volume production phase, using advanced Demand Flow Technology (DFT) to satisfy worldwide customer demand. Our ability to deliver the new product with short lea... »

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