News

Leti Demonstrates World’s First 300-mm Wafer-to-Wafer Direct Hybrid Bonding with 1-Micron Pitch on EV Group System
Photo 1 Photo 2

Leti Demonstrates World’s First 300-mm Wafer-to-Wafer Direct Hybrid Bonding with 1-Micron Pitch on EV Group System

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and Leti, an institute of CEA Tech, today announced the world’s first successful 300-mm wafer-to-wafer direct hybrid bonding with pitch dimension connections as small as 1µm (micron). This breakthrough also achieved copper pads as small as 500nm. The copper/oxide... »

The Memory Packaging Market Shows Steady Growth
ILLUS_MEMORYPACKAGING_DRAM_NAND_MemoryPackage_Forecast_YOLE_Oct2017 (433x280) ILLUS_Samsung_HBM2_SYSTEMPLUSCONSULTING_Sep2017

The Memory Packaging Market Shows Steady Growth

The memory industry is experiencing a strong growth phase: the total memory market is expected to increase at a ~9% CAGR 2016-2022, reaching about US$135 billion by 2022, with DRAM and NAND constituting almost 95% market share. Moreover, a supply-demand mismatch is pushing memory device asking selling price (ASP), resulting in big memory integrated device manufacturers (IDMs) reaping record profit... »

MEMS Packaging Market is Growing Faster Than The MEMS Devices Market
ILLUS_MEMS_PACKAGING_MarketForecast_YOLE_Oct2017 (433x280) ILLUS_AKM_Magnetometer_Packaging_SYSTEMPLUSCONSULTING_Oct2017 (433x280)

MEMS Packaging Market is Growing Faster Than The MEMS Devices Market

According to Yole Développement (Yole), the MEMS packaging market will grow from US$2.56 billion in 2016 to US$6.46 billion in 2022, showing a 16.7% CAGR[1] over this period. The MEMS packaging market’s value is growing faster than the MEMS device market’s value: respectively, a 16.7% CAGR for packaging versus 14.1% for devices, during the period 2016 – 2022. Under this dynamic context,... »

aveni® S.A. Raises EUR 8.9M ($10.5M) to Commercialize its Innovative Metallization Technologies

aveni® S.A. Raises EUR 8.9M ($10.5M) to Commercialize its Innovative Metallization Technologies

PARIS, FRANCE–(Marketwired – Oct 24, 2017) – aveni S.A., developer and manufacturer of market disrupting wet deposition technologies and chemistries for 2D interconnects and 3D TSV packaging, today announced it has completed an EUR 8.9M ($10.5M) capital raise from Merck Ventures, the corporate venture arm of Merck, along with existing investors. “This new investment by corp... »

UnitySC Opens Global Software Development Center and Customer Demo Lab in the U.S.

UnitySC Opens Global Software Development Center and Customer Demo Lab in the U.S.

Austin, Texas – Oct. 23, 2017 – UnitySC today announced at the International Wafer Level Packaging Conference (IWLPC) in San Jose, Calif., the opening of Unity Semiconductor Inc., the company’s new global software development center and North America customer demonstration lab located in Austin, Texas. The new facility serves as the company’s main center for software development and will h... »

Page 1 of 73123»