3D InCites is an IMAPS Content Platform built with members in mind. There are a variety of opportunities for corporate members of IMAPS, media partners, and technical/subject matter experts of IMAPS to contribute content to 3D InCites. We accept news, press releases, blogs, articles (3DID), white papers, podcasts, videos and more. Below are guidelines for contribution and where to send them!
For more commercial advertisements of products and services, we recommend considering a variety of advertising options through IMAPS site and our 3D InCites platform.
Email ivolpe@imaps.org with submissions!
Community News Press Releases
We accept formal press releases or news write-ups with timely industry relevance from our IMAPS corporate members. Below are some requirements and the scope of press releases we accept. Press releases should include a Title, Featured Photo, and a Media contact with a name, email, and number.
Scope of Press Release:
- Technical achievements, research updates, or breakthroughs
- New Facility or partnership announcement
- Company milestones, including facilities expansion, funding, awards, acquisitions, partnership announcements, or chief leadership transitions.
Press releases should be relevant to Advanced packaging, Semiconductor manufacturing, Materials, Equipment, Design tools, Reliability/testing, and Related ecosystems. All press releases are subject to editorial review. Submissions that are purely promotional or lack news value may be declined or redirected to paid promotional opportunities.
Blogs & Technical Articles
Short to mid-range length editorial‑grade technical content from our corporate members that include an abstract, data, and vendor informed conclusions that align with advanced packaging topics.
The blog/article should fall under 3D In-Depth in one of these categories of 3D Integration, application, design, devices, manufacturing, materials, Processes & Technology, and Test & Application. Other packaging-related articles can also be submitted and may be categorized under other technical headers/themes.
White Papers
We accept long form technically rigorous and application‑focused, not promotional from our corporate members. These can be in the form of a formal PDF that contains Vendor‑neutral and data‑driven content that is suitable for industry distribution.
Become a Guest on the 3D InCites Podcast
Do you have an interesting topic to discuss or story to tell? Do you have important insight to share on the semiconductor and microelectronics industries? Pitch us your ideas, and we’ll consider it for an upcoming episode.
If you’re interested in sponsoring the 3D InCites Podcast, or being spotlighted in your own episode, check out the offerings on our IMAPS Corporate Membership Page.
Archived Buzz Sprout 3D Podcast Content…
