02/15/2022 - 02/17/2022 -12:00 am

Location: DoubleTree by Hilton Hotel

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Advanced Packaging: The Dawn of a New Era

The development of Advanced Package Technology is undergoing a massive change because Electrical System Architects are directly driving package performance requirements, something which has never happened before. Previously System Architects designed circuits around package limitations because pushing package technologies outside of their “comfort zones” often led to undesirable results.
With the rise in transistor costs and the need to improve power efficiency, Silicon Architects have little choice but to push advanced package technologies well beyond their comfort zones.

February 15-17, 2022

DoubleTree by Hilton San Jose

2050 Gateway Pl, San Jose, CA 95110

The Wafer-Level Packaging Symposium will bring together the semiconductor industry’s most respected authorities to address all aspects of wafer-level, 3D device packaging, advanced manufacturing & test technologies.
Addressing wafer-level packaging, 3D, and Advanced Manufacturing & Test technologies, the Wafer-Level Packaging Symposium will be at the forefront of packaging technology evolution. The conference will feature attendees from around the globe in the heart of Silicon Valley to immerse themselves in the latest technology and business trends.

Top Reasons to Present at This Symposium:

1. Gain company recognition. This symposium will gather more than 230 companies. Ensure that your technology is represented.

2. Educate customers to this technology. Your next biggest customer could be attending your presentation!

3. Sharpen your technical writing and presentations skills. Prepare and present at the symposium to help you refine your skills.

4. Your presentation and paper will have extended shelf life beyond the symposium. The papers and presentations will be available to all that attend the conference and papers will be published in the IEEE Xplore Digital Library.

5. Your paper will be reviewed by your peers through technical committee evaluation.

6. Earn a best paper award. Winners are chosen by the technical committee and attendees based on technical merit, relevance, originality, knowledge of subject, quality of material and quality presentation. Winners will be recognized with awards during the opening comments the following year. Awards include: Best of Conference Paper, Best of WLP Track, Best of 3D Track, and Best of Advanced Manufacturing and Test Track.

7. Save hundreds of dollars! Speakers receive a discount on conference registration.


Submit your abstract today!