Glass has enormous potential for wafer-level packaging applications, but so far most of the industry is searching for an economical process to unlock this potential. Laser-induced deep etching (LIDE) is about to change the to change this prospective fundamentally, as it is capable to fabricate high-precision and high aspect-ratio features in glass, completely free from defects at very low cost.
LPKF Laser & Electronics is hosting webinar about the fundamentals of laser-induced deep etching for wafer-level packaging applications.
Webinar:
Unlock the Potential of Glass in Wafer-Level Packaging
Presented by Rafael Santos, PhD
Thursday, May 12th, 2020 at 9 am Pacific Time
Please register here: https://register.gotowebinar.com/register/39512456406877198
You can learn more about the Laser Induced Deep Etching technology by visiting www.vitrion.com.
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LPKF Laser & Electronics
12555 SW Leveton Dr.
Tualatin, OR 97062
Tel. (503) 454-4200
