Themed Heterogenous Integration: Bolstering Europe’s Resilience, SEMI Europe’s 3D & Systems Summit 2025 will primarily focus on exploring strategies for enhancing Europe’s semiconductor industry addressing topics as geopolitical dynamics, market trends, as well as the latest advancements in chiplet applications and hybrid bonding techniques. The Summit will feature an exclusive exhibition area, showcasing industry leaders alongside innovative emerging companies. This Summit is a platform for gathering and exchange of knowledge and fostering of collaborations within the semiconductor sector. Sessions include:
- Geopolitical Dynamics and Market Trends
- Chiplet Applications: System Level Architectures
- Hybrid Bonding – Die to Wafer
- Hybrid Bonding – Wafer to Wafer
- Photonics and Co-Package Optics
- European Readiness: Design, Materials, Manufacturing
Attendees will have several opportunities for B2B matching, including networking receptions, coffee breaks, lunches, and a unique Networking Dinner Cruise along the beautiful Elbe River.
Several 3D InCites members are among the speakers including KLA’s Dave Thomas; Comet Yxlon’s Isabella Drolz; TechSearch International’s Jan Vardaman; Jekaterina Victorova, Syenta; and Seung Kang, Adeia
Learn more about the speaker line up here.
