This year, 3D & Systems Summit and MEMS & Imaging Sensors Summit will take place virtually, and co-located.
The SEMI Connected Heterogeneous Systems Summit brings together thought leaders and industry experts from the entire 3D & Systems and packaging and, MEMS/imaging/sensor value chain to discuss the latest advancements in Heterogeneous Integration and sensing technology driving innovation in high end applications.
Three Days | Two Summits | One Ticket
- Technology Showcases of Innovative New Products
- Market Updates for Semiconductors and Applications
- Heterogeneous Integration
- 3D & Systems Design
- MEMS & Imaging Sensor Technologies
The Technology Showcase will highlight some of the newest and most unique product launches in the fields of 3D, heterogeneous integration, MEMS and imaging. We welcome new companies and faces entering the semiconductor industry with innovative new ideas and products. This session will be your platform giving you the chance to get seen, known and becoming part of our community.
- Deep tech companies (startup incubators / investors)
- Teams of established companies working on new product launch (2021 + 2022 launch)
Selected presenters will receive:
- One complimentary pass to the summit
- 5-8 minutes presentation slot to pitch the audience
The winners receive a FREE BOOTH for the event next year.
(Abstract submission has been closed. We thank to all the participants who have submitted their abstract.)
Any questions? Please contact: Pantelitsa Markus at email@example.com