Save the date for the SEMI 3D & Systems Summit, to be held January 27-29, 2020, in Dresden, Germany, where top experts will gather to discuss the latest developments and insights in the 3D roadmap, heterogeneous integration and system-in-package technologies.3D in packaging and transistor cell design is critical to scaling the performance of integrated circuits to meet the demands of artificial intelligence (AI), machine learning and other data-intensive applications.
New, broader topics to include:
- 3DIC Through-Silicon-Via (TSV) technology
- 2.5D, 3D FO-WLP/e-WLB
- Heterogeneous Integration
- Stacked dies and stacked wafers
- 3D alternative technologies
- 5G applications
- uLED and photonics applications
Event speakers will explore disruptive applications such as mobile Internet of Things (IoT) and high-performance power electronics. Scheduled presenters include experts from global leaders such as AMKOR, ASE Group, Dow, GLOBALFOUNDRIES, Savansys, SystemPlus, STMicroelectronics, TechSearch International, Yole Développement and Xperi.