Save the date for the SEMI 3D & Systems Summit, to be held January 27-29, 2020, in Dresden, Germany, where top experts will gather to discuss the latest developments and insights in the 3D roadmap, heterogeneous integration and system-in-package technologies.3D in packaging and transistor cell design is critical to scaling the performance of integrated circuits to meet the demands of artificial intelligence (AI), machine learning and other data-intensive applications.
New, broader topics to include:
- 3DIC Through-Silicon-Via (TSV) technology
- 2.5D, 3D FO-WLP/e-WLB
- Heterogeneous Integration
- Stacked dies and stacked wafers
- 3D alternative technologies
- 5G applications
- uLED and photonics applications
Event speakers will explore disruptive applications such as mobile Internet of Things (IoT) and high-performance power electronics. Scheduled presenters include experts from global leaders such as AMKOR, ASE Group, Dow, GLOBALFOUNDRIES, Savansys, SystemPlus, STMicroelectronics, TechSearch International, Yole Développement and Xperi.
Registration is now open with early-bird pricing until 30 November, 2019. Visit 3D & Systems Summit for more information.
