The Northern California Chapter of the American Vacuum Society is conducting a Joint User Group Meeting on Thursday 09 June 2016 at SEMI HQ in San Jose, CA.
All are welcome; admission is free, as is a light lunch.
Topics and Speakers are:
Novel Process of RDL formation for Advanced Packaging by Excimer Laser Ablation
Markus Arendt, SUSS MicroTec Photonic Systems Inc.
Fun times in multi-die integration: Thin, small, 2D, 3D and in-between
Sesh Ramaswami, Applied Materials Inc.
Optical Metrology and Inspection for Fan-Out Wafer Level Packaging (FOWLP)
Ben Garland, Jim Xu, Ph.D., and Vamsi Velidandla , Zeta Instruments Inc.
CMP for Advanced Packaging Robert L. Rhoades, Entrepix, Inc.
Between 2D and 3D: WLFO Packaging Technologies and Applications
Minghao Shen, Altera Corporation (now part of Intel)
For more information: http://www.avsusergroups.org/tfug/tfug_announce.htm