06/09/2016 -12:30 pm - 4:30 pm

Location: SEMI Global Headquarters

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The Northern California Chapter of the American Vacuum Society is conducting a Joint User Group Meeting on Thursday 09 June 2016 at SEMI HQ in San Jose, CA.

All are welcome; admission is free, as is a light lunch.

Topics and Speakers are:

Novel Process of RDL formation for Advanced Packaging by Excimer Laser Ablation
Markus Arendt, SUSS MicroTec Photonic Systems Inc.

Fun times in multi-die integration: Thin, small, 2D, 3D and in-between
Sesh Ramaswami, Applied Materials Inc.

Optical Metrology and Inspection for Fan-Out Wafer Level Packaging (FOWLP)
Ben Garland, Jim Xu, Ph.D., and Vamsi Velidandla , Zeta Instruments Inc.

CMP for Advanced Packaging Robert L. Rhoades, Entrepix, Inc.

Between 2D and 3D: WLFO Packaging Technologies and Applications
Minghao Shen, Altera Corporation (now part of Intel)

For more information: http://www.avsusergroups.org/tfug/tfug_announce.htm