|Semiconductor360 LIVE 2021 is the first international virtual event by Semiconductor360.com, for the international semiconductor community, as a flexible, quick, and quality answer for these challenging times.|
Amkor will be presenting the following:
Test & Packaging Track – Tuesday, March 16
· 17:00-17:20 – YoungDo Kweon, Sr Director Research and Development, “High Thermal Performance TIM for Lidded FCBGA Products”
· 17:20-17:40 – Michael Kelly, VP, Advanced Package & Technology Integration, “Heterogeneous IC Packaging”
All times are Israel time.
For additional info and to register for this FREE industry event, visit Semiconductor360-live.com