03/16/2021 -12:00 am

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Semiconductor360 LIVE 2021 is the first international virtual event by Semiconductor360.com, for the international semiconductor community, as a flexible, quick, and quality answer for these challenging times.

Amkor will be presenting the following:

Test & Packaging Track – Tuesday, March 16

·    17:00-17:20 – YoungDo Kweon, Sr Director Research and Development, “High Thermal Performance TIM for Lidded FCBGA Products”

·    17:20-17:40 – Michael Kelly, VP, Advanced Package & Technology Integration, “Heterogeneous IC Packaging”

All times are Israel time.

For additional info and to register for this FREE industry event, visit Semiconductor360-live.com