The 14th Annual International Wafer-Level Packaging Conference (IWLPC) and Tabletop Exhibition takes place October 24-26, 2017 in San Jose, California. Get ready for a jam-packed week of the latest innovations in wafer-level packaging, 3D, and MEMS technologies from keynote speakers, informative panelist, and educational workshops. The conference comprises three parallel technical tracks with two full days of presentations offered by world-class experts and provides a collective network of over 800 industry professionals, including vendors from leading semiconductor companies, foundries, and OSATs, as well as key technology, equipment, and materials suppliers in the exhibit area. Discover more about this event and be a part of the community.
