11/05/2013 - 11/07/2013 -8:30 am - 5:00 pm

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This year the International Wafer-Level Packaging Conference (IWLPC 2013) is celebrating its 10th Anniversary. Organized by SMTA and ChipScale Review, the 10th annual IWLPC will be host to some of the  most respected industry experts. The conference tutorials and exhibition will encompass the latest and greatest of wafer-level, 3D TSV, and MEMS device level packaging.

Keith Cooper, technical chair of IWPLC even suggests arriving a day before technical sessions begin to attend tutorial sessions given by none other than Rao Tummala, Ph.D. of Georgia Tech, Luu Nguyen, Ph.D. from Texas Instruments Inc, John H. Lau, Ph.D. from Industrial Technology Research Institute (ITRI), and Herb Neuhaus, Ph.D. of TechLead Corporation. In addition, IWLPC announced that Paul Wesling will give the Keynote Breakfast Address, discussing the history on Silicon Valley.

While 3D topics  generally share the stage with wafer level packaging, and MEMS at IWLPC, this year, there were so many submissions to the 3D Track, organizers expanded the Thursday agenda to accommodate two parallel 3D tracks. You’ll need to choose between Interposers and Metrology and Test in the morning, and TSV processing and implementation and 3D processing in the afternoon.

That’s not all. This year’s 3D Thursday features a plenary talk by Simon McElrea, Invensas, titled A Consumer Driven Market – This Changes Everything, which examines why the traditional semiconductor manufacturing model is stuck in the PC era, and can’t keep pace with savvy consumer demand, and what is needed to inspire change in the ecosystem and infrastructure.

Be sure to book a late flight home, because you won’t want to miss the 3D Panel Discussion, 3D High Volume Manufacturing — Are We There Yet moderated by Invensas’ Sitaram Arkalgud and features panelists Jim Walker, Research Vice President of the Semiconductor Manufacturing and Emerging Technologies Group Gartner; Abe Yee, Sr. Director of Advanced Technology and Package Development, nVidia; Laura Rothman Mauer, CTO, SSEC; and Suresh Ramalingam, Ph.D, MIT.

Be sure not to miss the chance to to learn about emerging technologies of the industries at such a gathering of vendors, users, and decision makers. Learn more about the IWLPC and registration here. The complete IWLPC 2013 agenda is available here.