The 21st Annual Device Packaging Conference (DPC 2025) will be held in Phoenix, Arizona, on March 3-6, 2025. This international event, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. People who will benefit from IMAPS DPC 2025 include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.
The 2025 conference will feature four keynote presentations, technical sessions on Heterogeneous: 2D and 3D Integration | Emerging Technologies | Fan-Out, Wafer, Panel Level & Flip Chip Packaging, 16 Professional Development Courses, a Global Business Council Plenary Session, interactive poster session, evening panel discussion, and more.
Location details:
- March 3-6, 2025 at the Sheraton Wild Horse Pass
- 5594 W. Wild Horse Pass Blvd Phoenix, AZ 85226
Keynotes from:
- Hemanth Jagannathan, IBM
- Sung Jin Kim, Absolics, Inc.
- JB Baker, Scaleflux
- Luu Nguyen, PSI Quantum
Other events:
- 3D InCites award ceremony – March 4 following the morning keynotes
- 3D InCites backyard olympics – March 5th from 7-9 p.m in conjunction with the DPC/Medical Workshop Poster Session
- Golf – Four person scramble, March 6th at 1:30 p.m.
- Guided hike – March 6 at South Mountain park
