The 22nd Annual Device Packaging Conference 2026 will be held in Phoenix, Arizona from March 2-5, 2026. It’s an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.
Those wishing to present their work at the Device Packaging Conference 2026 must submit a 500+ word abstract electronically no later than September 15, 2025, using the online submission system. No formal technical paper is required. A 2-6 page concise summary (“extended abstract”) with text (figures and graphs included if necessary) will be required for the abstract booklet on January 15, 2026. A post-conference DOWNLOAD containing the full presentation material as supplied by authors will be emailed after the event to all attendees. Please contact Kristie Bowman by email at kbowman@imaps.org if you have questions.
Device Packaging Professional Development Courses (PDCs):
For those wishing to broaden their knowledge of device packaging, a selection of half-day courses will be offered on Monday, March 2nd , preceding the technical conference. If you would like to participate as an instructor, please submit a description of your short course using the online submission system no later than September 15, 2025.
