On February 21-23, 2024, IEEE will host the 7th annual Heterogeneous Integration Roadmap Conference at the Samsung Electronics Campus in San Jose, California. The event features a diverse range of keynote speakers and panelists.
On February 21st, Subramanian S. Iyer, NAPMP Director, will present on the National Advanced Packaging Manufacturing Program (NAPMP). The morning conference sessions on February 22nd and 23rd, from 9:00 a.m. to noon, will include presentations by invited keynotes. In the afternoon, the HIR Technical Working Groups will provide concise updates for the 2023-2024 period.
The mornings of February 22nd and 23rd kick off with a session including the Conference Opening Welcome, HIR Technology Focus and Future Vision, and Keynote Speakers, such as Moonsoo Kang from Samsung and Alan Smith from AMD. After a lunch break, the afternoon session will showcase HIR Technical Working Group (TWG) Presentations from Group 1 and Group 2, followed by wine tasting.
Presentations will include speakers like Wei-Chung Lo and Shih-Chieh Chang from EOSL-ITRI, Bob Wisniewski from Samsung, and Josh Fryman from Intel.
Sessions will cover specific topics such as MEMS and sensors integration, single and multi-chip integration, integrated power electronics, emerging research devices, high-performance computing, and data centers, 2D-3D interconnect, thermal management, integrated photonics, 5G communications, aerospace and defense, fan-in and fan-out wafer-level packaging, emerging research materials, and cyber security, among others.
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