Join us for a closer look as industry experts discuss how material suppliers are responding to this dynamic technology environment.
The Heterogeneous Integration Roadmap (HIR) provides a long-term vision for the electronics industry to move beyond CMOS scaling, identifying difficult future challenges and potential solutions. New activities, such as MRHIEP, take the Roadmap a step further into how manufacturing and packaging processes will change and advance. Heterogeneous Integration is and will be the key technology direction going forward.
