The Global Interposer Technology 2014 Workshop (GIT 2014), sponsored by IEEE, is intended to stimulate development of most advanced semiconductor and systems packaging technologies, comparing and contrasting a wide variety of interposer and package technologies being developed such as silicon, organic, and glass.
GIT 2014 brings together academic and industry researchers from end-users, device manufacturers, interposer substrate manufacturers and supply chain companies that supply materials and tools from around the world. Such interposer and package technologies have many applications including packaging of ICs in 2D, 2.5D and 3D for smart and wearable, automotive, and high performance systems. This year’s co-chairs are Prof. Rao R. Tummala, Director, 3D Systems Packaging Research Ctr, Georgia Tech; Matt Nowak Senior Director Advanced Technology, QUALCOMM;and Subramanian Iyer Director, Systems Scaling Technology, IBM.
GIT 2014 will focus on Interposer Technology with an expanded 2 1/2-day agenda including 10 plenary keynotes, and a plenary panel discussion, as well as six technical sessions and an academic poster sessions. The technical sessions focus on:
- Glass Interposers
- System Integration with Interposers
- Panel Manufacturing Infrastructure:Tools and Materials
- Design and Design Tools: Electrical, Thermal and Mechanical Design
- Organic and WLFO Interposers
- Interposers for RF and Power
Network and hear perspectives from key decision-makers from companies such as: 3M; AGC; Ajinomoto Fine-Techno Co., Inc.; Amkor Technology; ANSYS, Inc.; Asahi Glass; Atotech Deutschland GmbH; CALCE, University of Maryland; CEA – LETI/MINATEC; Ciena; Coherent LaserSystems GmbH & Co KG; Columbia University; Corning Inc.; Dai Nippon Printing; DISCO; DNP; Dow; EPCOS AG; EV Group; Georgia Institute of Technology; Global Foundries; Harris Corp.; Hitachi Chemical; Ibiden; IBM; IIT-ROORKEE; IMAT; Intel; KAIST; Kulicke and Soffa; Kyocera America; LPKF Laser & Electronics AG; Mentor Graphics; Micron Technology; Mitsubishi; Mitsubishi Electric Corp.; Mitsubishi Gas Chemical; Mitsui Mining & Smelting; MKS Instruments; MRSI Systems; M-Solv Ltd; Namics; Nanium; NGK Spark Plug; Northrop Grumman; NTK Technologies; NVIDIA; Orbotech; Panasonic; Qualcomm; Rudolph Technologies; SanDisk ; SCHOTT AG; S-Cubed; Semtech; Shinko; ; Solid State Equipment LLC; SPTS Technologies; SUNY Binghamton University; Suss MicroTec; Tango Systems; TE Connectivity; Technische Universität Dresden; TechSearch International, Inc.; Teralab; Texas Instruments; Toppan Printing Co., Ltd; Triton Microtechnologies; UCLA; Unimicron; Ushio; Xilinx; Yole Developpement; Zeta Instruments; Zuken