05/11/2016 -All Day

Location: Holiday Inn

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Call for Abstracts

The MEPTEC MEMS program committee would like to invite you to submit an abstract for the 14th Annual MEPTEC MEMS Technology Symposium. The theme is “Advancing MEMS for Today’s Exploding Demands”. The deadline to submit is March 17. The requirements are minimal. Instead of writing a paper you will submit slides for presentation. Deadlines and Guidelines will be sent to you upon approval of your abstract. NOTE: Please obtain attendance and travel approval prior to submitting. When a paper is accepted it is our expectation that you have budget approval for travel costs (no charge for attending).

Topics of interest

MEMS Design

  • Reusability
  • Systems design
  • Design for reliability
  • Security
  • Managing complexity

Process Technologies

  • Cost effective processes
  •  Process integration
  • Process re-use/standardization

Packaging

  • Multi-die packaging
  • Special purpose packaging
  • Package standardization

Test

  •  Design for MEMS testing
  • High volume automated test
  •  Multi-die testing

Emerging Technologies

  • Flexible, hybrid, printed MEMS and sensors

Abstract should be 250-300 words to cover the objectives of the presentation, indicate relevance to the conference theme and audience and have a call to action for the industry. More details are available here.