10/10/2016 - 10/13/2016 -All Day

Location: Hyatt Regency San Francisco Airport Hotel

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The IEEE SOI-3D-Subthreshold (S3S) Microelectronics Technology Unified Conference, aka the IEEE S3S Conference, is an industry-wide event gathering together widely known experts, contributed papers and invited talks focused on SOI Technology, Low-Voltage Devices/Circuits/Architectures, and 3D Integration. A special focus area of the Conference in 2016 will be on energy efficient computation and communication to empower small systems. This is a timely topic given recent projections that the number of Internet–connected devices will grow to 75 billion by 2020. Energy-efficiency is key to enabling small, battery-powered sensors and wireless connectivity hubs. The IEEE S3S organizers are pleased that the core technologies of the S3S Conference are sure to play critical roles in efficient computation and communication in energy-starved systems.

Featured at this year’s event is a panel discussion moderated by Françoise von Trapp, comparing
Monolithic 3D vs. TSV. The panel takes place Monday, Oct 10 8pm. The panelists include:

  • Paul Franzon, Professor, NCSU & 3DIC 2016 Conference Co-Chairs
  • Eugene Fitzgerald, Professor at MIT & Lead PI, SMART Research Center
  • Zvi Or-Bach, CEO MonolithIC 3D
  • Bob Patti, CTO at Tezzaron Semiconductor
  • Arifur Rahman, Intel/Altera & pioneer of 2.5D at Xilinx

The panel will discuss the alternative technologies proposed to advance the semiconductor industry forward to 3D.

Françoise von Trapp is known as the ‘Queen of 3D’ for founding the 3D InCites community covering the field for more than 10 years. Dr. Arifur Rahman is one of the early inventors of the 2.5D technology while working for Xilinx, fielding the first commercial 3D systems. Paul Franzon has been the US chair for the IEEE 3D IC conference with more than 10 years research and development work of 3D system using TSV at mini-TSV. Bob Patti is the US co-chair of IEEE 3D IC conference and co-founder and CTO of Tezzaron, the only semiconductor company dedicated to TSV base 3D devices. Tezzaron is known with their via middle approach offering mini-via technologies. Eugene Fitzgerald of MIT & Lead PI, SMART Research Center, is a leader in 3D heterogeneous integration of various silicon and non-silicon devices. These devices are being developed at the SMART Research Center. Zvi Or-Bach, CEO of MonolithIC 3D has been dedicated to developing monolithic 3D technologies since 2009 and holds more than 80 US patents on the processes.

For more information on S3S, or to download the advanced program, please visit the website here.