2022 Edition. In Engineer of the Year
Founder of CVInc., Terence has been in the electronics packaging industry for over 30 years. In the past 5 years he has won a few significant battles:
• He kicked pancreatic cancer in the butt in 2016.
• He won an SBIR (Small Business Innovation Research) by demonstrating the capability to fabricate 20µm diameter vias over 500µm deep in glass substrates.
Terence has also managed to fabricate a very high-density flex less than 25µm thick. With pad and pitch spacing less than 30µm, this will be a game-changing solution. Single die bumping - no problem. Terence has also devised a method to grow copper pillars on a single die with an 8µm diameter and 20µm tall geometries.
Finally, Terence plans to spin off a venture to become instrumental in green energy. He is starting an initiative to convert CO2 to renewable energy and plans to begin demonstrating this solution in the next couple of months.