ERS electronic GmbH

2022 Edition. In Equipment Supplier of the Year

In 2007, ERS developed the first solution for thermal debonding and warpage correction of eWLB packages. 15 years later, ERS continues to support Fan-out technologies with a broader portfolio of automatic, semi-automatic, and manual machines. Combining ERS’s core competencies, these tools address specific challenges in the packaging process, minimizing issues like tape residue, die shift, and handling-induced warpage. They can be found on the production floors of most of the OSATs in the world and are also in use at research institutes, such as Fraunhofer IZM and IME A*Star. In 2021, ERS launched the APDM650 for panels up to 650 x 650 mm, paving the way for high volume manufacturing of large area FOPLP. Their flagship machine, the Automatic Debond Machine (ADM330), is the go-to thermal debond solution in the industry and is continuously being improved to support the ever-evolving complexities of new Fan-out products, with a significant update to be expected later this year.