As designers adopt advanced process technologies and very dense 2.5D/3D packaging techniques, the impacts of an ever-growing set of physical effects need to be considered when verifying the performance and reliability of chips.

ANSYS solutions give you the most comprehensive simulation platform in the industry for modeling chip thermal, power, and signal integrity, as well as package modeling and system-level thermal modeling for chip-aware systems. Tools such as ANSYS RedHawk and ANSYS IcePak ensure optimal performance for your integrated circuit or SoC design.

The integration of multiple ICs on the same package or the stacking of multiple ICs comes with several verification challenges. Ansys RedHawk-SC ElectroThermal gives you the ability to simulate multiple ICs modules that are integrated in a 2.5-D or 3D fashion. RedHawk-SC ElectroThermal can model interposers, through silicon vias (TSVs) and microbumps, including the different ICs. In addition to the IC components, an accurate model of the package can also be extracted and modeled during the power and signal integrity simulations.