Laura Mirkarimi, VP 3D Portfolio and Technologies, Xperi
2020 Edition. In Engineer of the Year
Laura Mirkarimi, VP 3D Portfolio and Technologies, Xperi led the team that successfully developed Xperi DBI Ultra, which the same elegant, room-temperature bonding approach as wafer-to-wafer (W2W) DBI, with the added benefit of being both die-to-wafer (D2W) and die-to-die (D2D) processes. It can be used in high volume manufacturing to stack memory, and also integrate that memory with sensors and logic in a 2.5D or 3D system-in-package (SiP).