Brewer Science has been supplying advanced materials to the semiconductor market for over thirty-nine years. For the last fifteen years, Brewer Science has been supplying temporary bonding/debonding materials that cover a wide variety of release methods, including chemical, thermal slide, mechanical, and laser release materials. These products provide the user with increased throughput, performance, and yield rates. Brewer Science’s wafer-level packaging materials enable device manufacturers to reduce the form factor and increase the efficiency of their products and processes. Brewer Science is committed to solving the biggest challenges in the compound semiconductor, 2.5D, 3DIC, and fan-out packaging market spaces.