Beth Keser and Steffen Kröhnert, Co-Authors, Advances in Embedded & Fan-out Wafer Level Packaging Technologies

2020 Edition. In Engineer of the Year

Drs. Keser and Kröhnert are nominated for their work publishing "Advances in Embedded and Fan-Out Wafer Level Packaging Technologies (Wiley - IEEE)."

About the book: Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons.