Dr. Doug Yu, Vice President of Integrated Interconnect and Packaging, TSMC
2020 Edition. In Engineer of the Year
Research, development, and commercialization of advanced packaging and system integration solutions, System on Integrated Chips (SoICTM) and their derivatives, TSMC’s wafer-level system integration technologies, Chip on Wafer on Substrate (CoWoS®), and Integrated Fan-Out (InFO).