Since 1981, Brewer Science has provided the market with advanced materials that both broaden and extend industry roadmaps. Brewer Science’s wafer-level packaging materials have enabled device manufacturers and assemblers to reduce the form factor and increase the efficiency of their products. Spearheading the temporary wafer bonding market with its chemical release platform in 2004, Brewer Science has had multiple generations of products that have increased throughput, performance, and yield rates. From chemical to thermal slide, and today with mechanical and laser release systems, Brewer Science is committed to solving the foremost challenges in the Compound Semiconductor, 2.5D, 3DIC, and Fan-out Packaging market spaces.