Cadence Design Systems
2019 Edition. In
Cadence plays an essential role in the creation of today’s ICs, advanced IC packages, and PCBs. Over the past three decades, Cadence has consistently demonstrated its commitment to providing EDA solutions that address the challenges of electronic product design. Cadence cross-domain co-design solutions deliver state-of-the-art design automation and have become the de facto standard in system-level co-design and advanced IC packaging.
Recently, Cadence announced the Virtuoso RF Solution. This cross-platform solution integrates the Cadence IC design platform with the Cadence advanced package design/analysis tools - including 3DEM and MoM modeling technologies - providing the industries first solution that delivers a holistic, system-level design flow - with built-in LVS - for RF and mixed-signal multi-die, heterogeneously integrated designs.