Eshylon Scientific’s multi-patented Mobile Electrostatic Carriers (MESCs) are revolutionizing temporary bonding for thin and exotic wafer handling. Eshylon’s reusable, long-life MESCs offer instant bond/debond on a single station with no adhesives, no clean steps, no ESD, no CTE mismatch and at temperatures exceeding 400°C. Eshylon MESCs are being successfully applied across many fab processes including metrology, lithography, deposition, dry etch, die singulation, substrate stacking, ion implant, transport handling and others. The Eshylon MESC platform delivers unmatched ROI for exotic material wafer handling and small wafer fab retrofits, allowing our customers the flexibility to run multiple size substrates or wafer pieces on existing tool sets.