Corning Precision Glass Solutions

2019 Edition. In Materials Supplier of the Year

Glass as a temporary carrier material has proven its value in advanced wafer thinning and high- performance fan-out packaging. As these technologies advance, new challenges emerge that require glass innovation. For example, more RDL layers require carrier glass to be thinner and thinner, yet in-process warp still needs to be managed and controlled. Precision Glass Solutions delivers value to customers through a unique set of capabilities under single leadership within Corning.