The Integrated Electronics Engineering Center is committed to the advancement of electronic packaging technology and the electronics industry. Founded in 1991, this New York State Center for Advanced Technology conducts leading edge research in a wide variety of packaging areas that benefit technological advancements, and member companies. Its Electronics Packaging Symposium in 2018 covered a broad array of topics presented by speakers of note from the Center itself and beyond; attendees heard about 2.5-3D Packaging, 5G Needs in Packaging, Bioelectronics, and Materials for Packaging and Energy Storage, among other program subjects.