Samsung

2019 Edition. In Device Manufacturer of the Year

n the Samsung Exynos 9110 with ePLP, the first generation of Samsung’s fan-out panel level package, Samsung has managed to bring together an application processor engine (APE) and a power management integrated circuit (PMIC) in the same package in a system-in-package (SiP)-PoP configuration. This solution is integrated on the main board of the Samsung Galaxy Watch. The module includes the Exynos 9110 application processor and Samsung’s Power management system in a single package < 80 mm². This is only the second multi-chip fan-out device on the market, according to System Plus Consulting.