The Rudolph JetStep S Lithography System for fan-out panel-based advanced packaging processes is used to produce system-in-package (SiP) products that combine sensor, processor and memory functions for the automotive industry.

SiP is ideally suited for panel manufacturing; the JetStep S System has the ability to process very large panel sizes up to 650mm x 720mm and its large field size that optimizes throughput for larger packages.

Increasingly, a number of manufacturers are investing in panel processing technology across a variety of applications, including SiP and large die processing for multiple high-end technologies. The JetStep system’s unique combination of imaging and handling capabilities is helping early adopters more quickly prove out the cost of ownership benefits of panel processing.