Adaptive Patterning, Deca Technologies

2018 Edition. In Process of the Year

Adaptive patterning for wafer level fan-out packaging permits the shift of the die following pick and pack to be accommodated during subsequent processing thereby resolving yield issues that may occur due to the placement tolerance. A comparison would be to suggest wire bonding be accomplished with or without pattern recognition. Its efficiency results in the choice of pick and place capital to be more focused on the cost effectiveness rather than purely placement accuracy.