2017 Edition. In
UnitySC's TMap Fan-Out metrology solution enabled FOWLP manufacturers to better understand their process and manage their yields. TMap Fan-Out is a single metrology tool solution for Fan-Out Wafer Level Packaging from molding process start to interconnect completion. It provides accurate measurement even under extreme warp condition. Unique on the market, it can provide a full stack thickness measurement in one single step, including PI on mold compound. UnitySC shipped multiple TMap Fan-Out to leading foundries, OSAT and IDMs in 2016.
UnitySC is an advanced process control company developing, manufacturing and marketing metrology and inspection solutions for heterogenous integration. UnitySC was launched in July 2016, combining FOGALE nanotech Group’s acquired Altatech assets with the former FOGALE Semicon division.