2016 Edition. In

NANIUM' is a world-class provider of advanced semiconductor packaging, assembly, and test, engineering and manufacturing services. The company is a leader in 300mm Wafer-Level Packaging (WLP), both Fan-In/ WLCSP, but mainly Fan-Out/ WLFO based on eWLB technology. NANIUM is well recognized in the packaging community worldwide and was awarded by several of its customers and co-operation partners emphasizing the high level of engineering and innovation creating leading edge packaging solutions such as FOWLP based WLSiP and WL3D. NANIUM is the largest OSAT in Europe and strongly engaged in activities strengthening this part of the Semiconductor Supply Chain. NANIUM is co-founder and chair of the ESiPAT Group (European SEMI integrated Packaging, Assembly and Test Special Interest Group).