Deca Technologies: • M-Series™

2016 Edition. In Device Technology of the Year

Conventional fan-out wafer-level packaging (FOWLP) is hampered by the cost of capital, die-attach cost, and yield. M-Series was built from the ground up to break down those barriers to adoption. M-Series features Adaptive Patterning™, a dynamic design and patterning process that resolves the issues associated with shifting die within an embedded device structure.