3D IC is emerging as a promising approach to extend Moore’s Law, overcome pin bandwidth limitations, and improve digital platform density and cost beyond a single chip. 3D IC as a technology, however, also introduces a number of key design, methodological, implementation and technological challenges that must be overcome to make them practical and cost-effective. Now in it’s 6th year, D43D is a two-day forum that brings together experts from industry and academia to shed light on these near-term to long-term challenges and solutions, and covers topics including, but not limited to, applications requiring 3D, 3D processor, memory and interconnect architectures, thermal management, design methodologies and tools, and testing.
The workshop will take place at EPFL, one of the premier institutions of computer science and engineering and ranked consistently among the most internationally diverse campuses, located on the shores of Lake Geneva in Switzerland. For hotel accommodation and workshop information please check our web site: www.d43d.com.
