Europe in 3D

Europe in 3D

Oerlikon Systems: Pragmatic and Poised for  3D IC High Volume Manufacturing
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Oerlikon Systems: Pragmatic and Poised for 3D IC High Volume Manufacturing

In the last 40 years, the Principality of Liechtenstein has evolved from a purely agricultural state into one of the most highly industrialized countries in the world. But some how it has managed to keep its Alpine charm. That’s why at first glance, the city of Balzers, complete with its hilltop castle, did not strike me as a place to find a major manufacturer of high tech semiconductor equipmen... »

3D Test

Cascade Microtech: In the imec 3D Test Lab

My visit to imec to meet with the Cascade Micorotech and imec 3D Test collaboration team included a tour of the 3D test lab to see the CM300 in action, so we suited up for Class 1000 cleanroom and stepped inside. Generally we would have had to prep for class 100 or higher for the test environment, but thanks to nifty new FOUPs that have a class 1 microenvironment to protect the wafers, we at least... »

Cascade Microtech Breaks Through the Barriers of 3D Test
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Cascade Microtech Breaks Through the Barriers of 3D Test

For quite some time, the lack of cost-effective test solutions for 2.5D interposers and 3D stacked ICs (3D SICs) has been at the top of many industry experts’ laundry list of ‘what’s-holding-up-commercialization for 3D’. First, there are technology issues: fine-pitch probing, pin count, contact force and the phenomenon of weak I/O drivers. But bigger than that, the cost of 3D test is a maj... »

3D Integration Workshop Faces Reliability Challenges Head On
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3D Integration Workshop Faces Reliability Challenges Head On

The Friday 3D Integration Workshop at DATE 2014 once again found me among friends, as an intimate group of about 30 gathered to spend a day sharing knowledge gained since last year’s workshop. My key take-away for the day was how to achieve reliability and robustness. Jürgen Wolf, director of the Fraunhofer IZM-ASSID 3D integration program stepped in as keynote speaker to replace Yole Développ... »

Calling for A Collaborative Semiconductor Supply Chain Comes at DATE 2014
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Calling for A Collaborative Semiconductor Supply Chain Comes at DATE 2014

Design and Test Europe 2014 (DATE 2014), which took place in Dresden, March 24-28 2014, brought together semiconductor design and test engineers from all over Europe and around the world for the purpose of understanding the latest trends, methodologies, and technologies being developed to address the ever-changing needs of chip design and test for the semiconductor and microelectronics industry. ... »

Copyright: Nino Halm (Photographer)
Interposer xctstudy1 xctstudy2 The Fraunhofer Campus in North of Dresden. Analytics Lab for IKTS. IZMASSID

The Fraunhofer Cluster for 3D Integration Looks at the Big Picture

Two years ago, I visited to Fraunhofer IZM-ASSID, located in Dresden, Germany; to see first-hand what this particular arm of Fraunhofer Gesellschaft was all about. Juergen Wolf, head of IZM-ASSID, gave me the grand tour of the 300mm cleanroom and explained the organization’s focus on developing Cu TSV technologies in 300mm wafers for both 2.5D interposer and 3D IC applications. For the past ... »

Silicon Saxony: Leading the Charge in More than Moore
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Silicon Saxony: Leading the Charge in More than Moore

Since the days even before the reunification of Germany; Saxony, and particularly Dresden, has been a vital center for microelectronics development in Europe. And since the reunification, Dresden has focused its investments on a single area: high technology and affiliated research. Both GLOBALFOUNDRIES and Infineon have a significant presence here, as well as many divisions of the Fraunhofer-Gese... »

Fogale Nanotech: Building The Swiss Army Knife of 3D IC Metrology and Inspection
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Fogale Nanotech: Building The Swiss Army Knife of 3D IC Metrology and Inspection

In the world of 3D ICs, where features are becoming finer and submicron accuracy and precision is more important than ever to maintain intra-wafer uniformity throughout the wafer or die stacking process flow, process control by means of metrology and inspection is more important than ever. The industry offers a number of non-destructive options – optical, X-ray, scanning acoustic microscopy – ... »

3D Architectures
Even the desserts look like 3D IC stacks! A welcoming committee fit for the Queen of 3D! Maison Carré, the most intact example of Roman architecture in Europe.

Nimes, France: Influencing 3D Architectures for 2000 Years

I first visited Nimes, France when I was sixteen, on one of those whirlwind, ten-day, school-organized trips with my French 2 class. What I remembered most about it was the Roman architecture. We spent less than 24 hours there on the way to Avignon. At the time, I would never have guessed that several decades later, I would be back to pay a visit to the world headquarters of Fogale Nanotech, manuf... »

Fraunhofer EMFT: 25 years of 3D Integration in Munich
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Fraunhofer EMFT: 25 years of 3D Integration in Munich

Wouldn’t it be great to get a text notification that you are almost out of toilet paper at home rather than when it’s well… almost too late? Or how about an intra-nasal sensor that detects the level of acetone in your breath to tell you if you’re accumulating or burning fat? (It kind of makes my new FitBit wearable activity monitor seem archaic already.) But this is the beginning of the I... »

Triple I Prevails at EV Group
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Triple I Prevails at EV Group

Invent, Innovate, Implement continues to be the mantra at EV Group, supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets. In visits I’ve made to EVG’s Schaerding, Austria world headquarters over the years, it’s clear that this Triple I approach is working for the company, which has experienced consistent growth. While I was sufficiently ... »

Automatic Wafer Metrology: Applying X-ray Technology in the 3D Space
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Automatic Wafer Metrology: Applying X-ray Technology in the 3D Space

The way I see it, it was only a matter of time before Nordson DAGE brought its X-ray technology into the 2.5D and 3D IC space. The company has long been the leader for X-ray inspection in the electronics market and is now positioned to address the growing need for wafer metrology and defect review in features such as through silicon vias (TSVs). According to John Tingay, Technical Director Nordson... »

Europe in 3D: The EV Group Story Continues…
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Europe in 3D: The EV Group Story Continues…

Rarely do I have the opportunity to visit a company two times and find something new to write about, never mind three. But as always, EV Group didn’t disappoint for my visit Friday (January 17, 2014) to see the company’s latest additions, both to the physical plant and to the product and technology line for 3D integration technologies.  My visit really started the evening before with a lovel... »

Europe in 3D: The Brains behind e-BRAINS
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Europe in 3D: The Brains behind e-BRAINS

After so many years covering 3D technologies, I love finding a new angle to write about. Yesterday’s visit to Fraunhofer EMFT in Munich provided just that. Instead of focusing on 3D IC processes, we talked about 3D systems integration and the e-BRAINS project. And rather than discussing the well-worn topic of mobile applications, we talked about other markets that stand to benefit from 3D hetero... »

Europe in 3D
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Europe in 3D: Nordson DAGE Sets Out to Measure the Invisible

What better place for the Queen of 3D to start out her Europe in 3D tour than a late lunch at the Crown Inn, in Colchester, Essex UK? I arrived in London on Monday afternoon, January 12, and was greeted by 3D InCites’ own Nick Richardson, business development manager (and unofficial court jester). We climbed aboard the chariot (aka Citroen Picasso) and headed to Colchester, UK to get our bearing... »

Europe in 3D: The 2014 Winter Tour
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Europe in 3D: The 2014 Winter Tour

This winter, I’ve been invited to moderate panels at two 3D industry events. The first will be at the European TSV Summit, which takes place January 22-23, 2014 in Grenoble, and the second is during the DATE 2014 3D Integration Workshop, March 28, 2014 as part of DATE 2014, which takes place this year in Dresden. It got me thinking, what better time to visit European companies working on 2.5D an... »

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