- Fifty years of Semicon Europa set a fitting backdrop for a conversation that feels both celebratory and unsentimental about the state of advanced packaging in Europe. We walk the floor in Munich and pull together a story that spans chemical metrology, panel plating, glass substrates, thermal materials, logistics resilience, and […]
- Europe’s chip future is being built in real time, and the view from Munich is electric. We sit down with IMEC’s leadership and ESMC’s founding CEO to unpack how pilot lines, a major Dresden fab, and the EU Chips Act are reshaping the continent’s strategy—from research to high-volume manufacturing. Along […]
- A crowded server board with ten thousand parts doesn’t forgive sloppy inspection—and neither do pricey GPUs and chiplets. From the floor of Productronica in Munich, we dig into how automated optical inspection keeps advanced packages honest once they hit the PCB line, where solder quality, coplanarity, and sheer component variety […]
- Want a candid look at how women build durable careers in one of the world’s toughest industries? We sit down with three semiconductor leaders – Nitza Basoco, Anne Meixner and Julia Freer – who share how early encouragement, gritty problem solving, and clear communication turned curiosity into impact. From summer […]
- Power electronics are quietly rewriting the rules of energy use—from the range of your EV to the efficiency of a hyperscale data center. Françoise sits down with Henkel’s Ram Trichur to unpack what’s driving the $67.5B surge in power semiconductors and why the move to wide bandgap materials like silicon […]
- The floor in Phoenix was packed, and so were the ideas. We sat down with innovators across the stack—equipment makers, metrology experts, logistics strategists, and software leaders—to map the real state of advanced packaging and what it takes to build, measure, move, and power tomorrow’s chips.EV Group kicked things off […]
- A nationwide talent engine for chips is taking shape—and it’s built to scale. Recorded live at SEMICON West in Phoenix, we sit down with SEMI Foundation leaders to unpack the National Network for Microelectronics Education, a hub-and-node model designed to align schools, employers, and workforce systems. Backed by CHIPS Act […]
- We recorded live at IMAPS with Siemens, ACM Research, Shellback Semiconductor, DECA, Nordson Electronic Solutions, and VIEW Micro Metrology to explore how AI demand, chiplets, and panels are reshaping advanced packaging. We dig into 3D BLOX, thermal and test roadblocks, green chemistries, metrology at scale, and why the back end […]
- We record live at IMAPS to follow a first-time attendee’s leap into advanced packaging and a trio of high school students discovering semiconductors, robotics, and career paths that bridge disciplines. Along the way, we unpack speed-to-market, standards, hybrid vs TCB, and why AI skills matter.• why a self-funded first conference […]
- We sit down with Dr. Subu Iyer of UCLA to unpack chiplets vs dielets, why a universal ecosystem is missing, and how sub‑10 µm bump pitch could make protocols optional. Then we host a panel featuring John Knickerbocker, IBM; Mike Kelly, Amkor; and Tolga Tekin, Fraunhofer IZM on co‑packaged optics, […]
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Do you have an interesting topic to discuss or story to tell? Do you have important insight to share on the semiconductor and microelectronics industries? Pitch us your ideas, and we’ll consider it for an upcoming episode.
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