Direct Bond Interconnect - Invensas

2017 Edition. In Process of the Year

DBI technology is a low-temperature hybrid wafer bonding solution that allows wafers to be bonded with exceptionally fine pitch 3D electrical interconnect without requiring bond pressure. DBI 3D interconnect can eliminate the need for thru silicon vias (TSVs) reducing die size and cost while providing a roadmap to pixel level interconnect for future generations of image sensors.