UBM

Citius, Altius, Fortius: Packaging Topics at SEMICON Korea 2018

Citius, Altius, Fortius: Packaging Topics at SEMICON Korea 2018

Winter 2018, and Korea is at the center of the world in both sports and in electronics. Sports, of course, because of PyeongChang, host city for the 23rd Olympic Winter Games, with participants ranging from Eritrea to Tonga, along with the usual cold-weather-country (Norway, Canada, Sweden, etc.) players who showed up for the Games. And electronics, of course, specifically semiconductor device fab... »

SPTS: Sigma fxP PVD with Multi-Wafer Degas

SPTS: Sigma fxP PVD with Multi-Wafer Degas

SPTS’s Sigma® fxP, is a well established PVD system used in advanced packaging applications such as UBM and RDL. It utilizes batch degas technology that can improve Rc whilst maintaining high throughputs, despite the outgassing challenges posed from the increasing use of organics, such as mold in Fan-Out WLP. Testimonial Fan-Out Wafer Level Packaging (FOWLP) technology is an increasingly popula... »

SPTS Technologies’ Sigma fxP PVD System Selected by HuaTian Technologies for 300mm Flip Chip Bumping and CMOS Image Sensor Applications

SPTS Technologies’ Sigma fxP PVD System Selected by HuaTian Technologies for 300mm Flip Chip Bumping and CMOS Image Sensor Applications

One of China’s Leading Semiconductor Packaging Providers Chooses SPTS PVD Solution for new 300mm Expansion Newport, United Kingdom, 8 July, 2014 – SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, today announced that HuaTian Technologies (Kunshan) Co., Ltd. has selected an SPTS Sigma fxP physical vapor deposition... »

NEXX Systems: Going Strong in Tough Times

View slide show of my visit to NEXX »