TSV fill

Lam Research: SABRE 3D

Lam Research: SABRE 3D

SABRE® 3D is a next-generation electroplating product designed to meet leading-edge production requirements for advanced packaging applications.  This product leverages proprietary front-end manufacturing technology and offers market-specific solutions for copper pillar and through-silicon via (TSV) fabrication.  SABRE 3D offers industry-leading throughput along with reduced cost of consumabl... »

Process Improvements Target 3D IC Cost of Ownership

Process Improvements Target 3D IC Cost of Ownership

Customers have asked and suppliers are listening. One sign of progress from last year to this year at SEMICON Singapore’s 3D IC Forum was the number of supplier presentations focused on process improvements that have been developed to lower the 3D IC cost of ownership (CoO). In addition to the cost-effective implementation of interposer technologies being worked on at Singapore’s A*STAR Instit... »

Polymer filled TSVs, Courtesy of EV Group

Polymer Filled TSVs: Solving the Cu Stress Issue

I’ve been on a quest to find out more about EV Group’s new polymer filled TSVs since they first announced it in September. According to a company press release, NanoFill™ process is said to provide “void-free via filling of very deep trenches and high-aspect ratio (HAR) structures, and is suitable for all common polymeric dielectrics—offering a highly flexible, low-cost and production-re... »

SEMICON West: Success for 3D –focused Companies

Is it mere co-incidence that companies who have invested in 3D technologies seem to have escaped the effects of the downturn and are the companies poised to lead industry growth? I think not. In speaking with various 3D companies at SEMICON West, they all seemed to have good news to share about the past year and moving forward. Alchimer CEO Steve Lerner talked about the company's latest additio... »